Multi-chip package – Samsung new release for 5GB smartphones

When it comes to memory chips, Samsung is the leading producer in the world for the product. As South Korean tech companies are thriving in the fast-growing handset market, Samsung recently released their new multi-chip package to beat the competition. Samsung has already started to mass-produce the new package to cater to the demand.

What do we have in this new MCP? Find LPDDR5 (low-power double data rate 5) Universal flash storage (UFS) Memory Chip Package (MCP), which includes high-performance NAND and DRAM flash memory chips. Samsung is also offering a range of storage capacity options to adhere to their customer requirements. NAND flash ranges from 128GB to 512 GB, while DRAM ranges from 6GB to 12GB. 

Multi-chip package

The new MCP boosts 25 GB per second read/write speed with its new LPDDR5 mobile DRAM. This is 1.5 times faster than the previous low power double data rate 4X (LPDDR4X). This time the UFS 3.2 interface-based NAND flash performs at 3GB per second twice as before. 

With this new multi-chip package, Samsung promises a better user experience for their customers as it will enable high-quality 5G content services. They say that the customers will get a stable 5G service even in low-tire devices due to the new uMCP. 

Being the world’s largest smartphone seller, Samsung never fails at giving the best solutions without compromising space efficiency. New uMPC measures only 11.5mm by 13mm in size. It is very convenient in size allowing handset manufacturers to explore many different design possibilities for their mobile devices. Samsung has already checked the compatibility of the LPDDR5 uMCP with other leading global smartphone manufacturers. They expect to launch their new mobile devices equipped with the uMCP starting this month. 

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